A new kind of technology for post CMP cleaning in IC fabrication

ECS Transactions

Volumn 18, Issue 1 PART 1, 2009, Pages 497-501

  Li, Wei Wei ^a  

^a HEBEI UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CLEANING EFFECT; CLEANING METHODS; CLEANING SOLUTION; COMMERCIAL PRODUCTIONS; ENVIRONMENT POLLUTION; IC FABRICATION; MEGASONICS; NEW MECHANISMS; NON-VOLATILE; ON-WAFER; ORGANIC BASE; ORGANIC SUBSTANCES; PARTICLE REMOVAL; POST-CMP CLEANING;

BLOCK COPOLYMERS; METAL IONS;

METAL CLEANING;

EID: 77950659381     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3096492     Document Type: Conference Paper

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