Experimental study of impingement spray cooling for high power devices

Applied Thermal Engineering

Volumn 30, Issue 10, 2010, Pages 1225-1230

  Yan, Z B ^a   Toh, K C ^a   Duan, F ^a   Wong, T N ^a   Choo, K F ^b   Chan, P K ^c   Chua, Y S ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^c DSO Laboratories   (Singapore)

Author keywords

Closed loop; High power electronic card; Impingement spray cooling; Large area

Indexed keywords

AVERAGE TEMPERATURE; CLOSED LOOPS; CLOSED-LOOP; COOLING PERFORMANCE; ELECTRONIC TEST; ENHANCED PERFORMANCE; EXPERIMENTAL STUDIES; HEATED AREA; HEATED SURFACES; HIGH POWER ELECTRONICS; HIGH-POWER DEVICES; INLET PRESSURES; MASS FLOW RATE; MAXIMUM TEMPERATURE; OPERATING CONDITION; REFRIGERATION CYCLES; SPRAY CHAMBER; SPRAY COOLING; SYSTEM USE; WORKING FLUID;

COOLING; HEAT TRANSFER; INLET FLOW; MASS TRANSFER; PIPE FLOW; REFRIGERATION; SPRAY STEELMAKING;

SPRAY NOZZLES;

EID: 77950629505     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2010.02.003     Document Type: Article

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