Compact 40 Gbit/s EML module integrated with driver ic

IEICE Transactions on Electronics

Volumn E92-C, Issue 7, 2009, Pages 951-956

  Yagisawa, Takatoshi ^a   Ikeuchi, Tadashi ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

40 Gbit s eml; Broadband bias tee; Driver IC integration; Feed through; VSR

Indexed keywords

FREQUENCY RESPONSE; INTEGRATED CIRCUITS;

40-GBIT/S; ACTUAL MEASUREMENTS; BROADBAND BIAS TEE; DRIVER IC; ELECTROMAGNETIC SIMULATION; FEED THROUGH; FLEXIBLE PRINTED CIRCUIT; MONOLITHICALLY INTEGRATED;

FLEXIBLE ELECTRONICS;

EID: 77950375759     PISSN: 09168524     EISSN: 17451353     Source Type: Journal    
DOI: 10.1587/transele.E92.C.951     Document Type: Article

References (11)

1. S. Ogita, H. Maruyama, and M. Kondo, "40 Gb/s electro- absorptionmodulator-integrated DFB laser with optimized design, " Proc. Optical Fiber Commun. Conf. (OFC), WV4, pp. 340-341, Anaheim, USA, March 2002. (Pubitemid 35412815)
2. X2 MSA, "A cooperation agreement for a small versatile 10 gigabit transceiver, " http://www.x2msa.org, April 2005.
3. XFP MSA, "10 Gigabit small form factor pluggable module, " http://www.xfpmsa.org, Aug. 2005.
4. T. Ikeuchi, T. S. Cheung, T. Yagisawa, N. Kuwata, T. Sato, M. Komiyama, T. Kunikane, and H. Hamano, "High performance XFP optical transceiver module for 80-km applications, " Proc. 10th OptoElectronics and Commun. Conf. (OECC), 6F2-3, pp. 322-323, Seoul, Korea, July 2005.
5. XMD MSA, "Multi-source agreement (MSA) of 10 Gbit/s miniature device (XMD), " http://www.xmdmsa.org, Jan. 2006.
6. XLMD MSA, "Multi-source agreement (MSA) of 40 Gbit/s miniature device (XLMD), " http://www.xlmdmsa.org, Feb. 2008.
7. H. G. Yun, K. S. Choi, Y. H. Kwon, J. S. Choe, J.-T. Moon, and M. H. Lee, "Right-angle-bent CPW for the application of the driveramplifier- integrated 40 Gbps TW-EML module, " ETRI Journal, vol. 28, no. 5, pp. 648-651, Oct. 2006.
8. T. Yagisawa, T. Watanabe, and T. Ikeuchi, "Compact 40-Gbit/s electroabsorption monolithically integrated DFB Laser (EML) module integrated with a driver IC for very short reach application, " Proc. 13th OptoElectronics and Commun. Conf. (OECC), WeC-1, Sydney, Australia, July 2008.
9. H. G. Yun, K. S. Choi, Y. H. Kwon, J. S. Choe, and J.-T. Moon, "Characteristics of a driver amplifier integrated 40 Gb/s EML module, " Proc. 57th Electronic Components and Technology Conf. (ECTC), pp. 1994-1999, Reno, USA, June 2007.
10. N. Okada, T Miyahara, T. Shinada, T. Saito, A. Sugitatsu, and T. Hatta, "43 Gbit/s EAM-LD module with built-in driver IC employing novel cathode-floating bias circuit, " Proc. 34th European Conf. and Exhibition on Optical Commun. (ECOC), vol. 3, We.1. C.3, pp. 29-30, Brussels, Belgium, Sept. 2008.
11. ITU-T Recommendation G.693, "Optical interfaces for intra-office systems, " http://www.itu.int/ITU-T