A new circuit augmentation method for modeling of interconnects and passive components

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 1, 2006, Pages 67-77

  Kolstad, Joel ^a   Blevins, Chris ^a   Dunn, John M ^b,c   Weisshaar, Andreas ^a  

^a Oregon State University   (United States)

^b TEKTRONIX INC   (United States)

^c Applied Wave Research Inc   (United States)

Author keywords

Circuit simulation; Equivalent circuit; Interconnect; Macromodel; Passive device; Passivity; Rational function approximation

Indexed keywords

ALGORITHMS; CURVE FITTING; LEAST SQUARES APPROXIMATIONS; OPTIMIZATION; PASSIVE NETWORKS; PERTURBATION TECHNIQUES; SCATTERING PARAMETERS;

CIRCUIT SIMULATION; PASSIVE DEVICE; RATIONAL FUNCTION APPROXIMATION;

EQUIVALENT CIRCUITS;

EID: 32444450150     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.862643     Document Type: Article

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