Wettability of sodium chloride aqueous solutions on SUS304 stainless steel with current flow

Materials Transactions

Volumn 51, Issue 2, 2010, Pages 359-365

  Wang, Rongguang ^a  

^a HIROSHIMA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Interface; Passive films; Pitting corrosion; Stainless steel; Wetting behavior

Indexed keywords

ANODIC CURRENTS; AQUEOUS SOLUTIONS; CATHODIC CURRENTS; CURRENT FLOWS; NACL SOLUTION; PASSIVE FILMS; PITTING CORROSION; SUS 304 STAINLESS STEEL; WETTING BEHAVIOR;

CONTACT ANGLE; PITTING; SODIUM; SODIUM CHLORIDE; WETTING;

STAINLESS STEEL;

EID: 77949660156     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.M2009336     Document Type: Article

References (25)

1. E. Colgate and H. Matsumoto: J. Vac. Sci. Technol. A 8 (1990) 3625-3633.
2. Z. Wan, H. Zeng and A. Feinerman: Proc. 2005 ASME International Mechanical Engineering Congress and Exposition, (2005) pp. 157-162.
3. J. Ralston: Aust. J. Chem. 58 (2005) 644-654.
4. H. L. Ricks-Laskoski and A. W. Snow: J. Am. Chem. Soc. 128 (2006) 12402-12403.
5. J. Lee and C. J. Kim: ASME DSC 66 (1998) 475-480.
6. J. Lee and C. J. Kim: Proc. IEEE MEMS, (1998) pp. 538-543.
7. H. Suzuki, H. Hosono and W. Satoh: Anal. Chem. 77 (2005) 6857-6863.
8. F. Mugele, A. Klingner, J. Buehrle, D. Steinhauser and S. Erminghaus: J. Phys. Condens. Matter 17 (2005) s559-576.
9. J. L. Jackel, S. Hackwood, J. J. Veselka and G. Beni: Appl. Opt. 22 (1983) 1765-1770.
10. V. H. Kwong, M. A. Mossman and L. A. Whitehead: Appl. Opt. 43 (2004) 808-813.
11. W. H. Hsieh and J. H. Chen: IEEE Photonic. Technol. Lett. 17 (2005) 606-608.
12. F. Krogmann, W. Moench and H. Aappe: J. Opt. A 8 (2006) s330-s336.
13. A. Kaneko, N. Moronuki, T. Shibata, J. Kogiso, K. Uchida and T. Kubo: Proc. 6th euspen (2006) pp. 288-291.
14. R. Wang, M. Kido and K. Mukai: Key Eng. Mater. 321-323 (2006) 1326-1331.
15. Y. Tsuru, Y. Yoshii, H. Suematsu and H. Katayama: Zairyo-to-Kankyo 55 (2006) 511-514.
16. M. Yamashita and H. Nagano: J. Japan Inst. Metals 61 (1997) 721-726.
17. R. Wang and M. Kido: Mater. Trans. 48 (2007) 1451-1457.
18. R. Wang, M. Takeda and M. Kido: J. Japan Inst. Metals 66 (2002) 506-512.
19. R. Wang, L. Cong and M. Kido: Appl. Surf. Sci. 191 (2002) 74-84.
20. N. Saito, I. Nakaaki, H. Iwata and O. Sugiyama: J. Vac. Soc. Jpn. 49 (2006) 443-445.
21. M. Maeda (ed.): Chemistry of Electrode, (Gihodo Shuppan Co. Ltd, 1962) pp. 167-169.
22. H. Kita and K. Uosaki: Foundation of Electrochemistry, (Gihoudou, 1990) pp. 130-143.
23. Y. Iwasawa, Y. Umezawa, Y. Sawada and K. Tsujii (ed.): Handbook of Interface: Chemistry and Engineering, (NTS Inc., 2001) p. 271.
24. K. H. Kang: Langmuir 18 (2002) 10318-10322.
25. Japan Society of Corrosion Engineering (ed.): Corrosion and Protection of Metals Q&A-Introduction to Electrochemistry, (Martuzen Co. Ltd, 2002) pp. 322-323.