Multiple chip integration for flat flexible electronics

PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photon

Volumn , Issue , 2008, Pages

  Govaerts, Jonathan ^a   Christiaens, Wim ^a   Bosman, Erwin ^a   Vanfleteren, Jan ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP INTEGRATION; ELECTRONIC CIRCUITRY; ELECTRONIC DEVICE; ELECTRONICS MARKETS; FLEXIBLE SUBSTRATE; MECHANICAL FLEXIBILITY; PORTABLE DEVICE; THIN CHIPS;

ADHESIVES; COMPUTER CRIME; FLEXIBLE DISPLAYS; MICROELECTRONICS; POLYMERS; SUBSTRATES;

ELECTRON DEVICES;

EID: 77950875743     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PORTABLE-POLYTRONIC.2008.4681283     Document Type: Conference Paper

References (2)

1. W. Christiaens, B. Vandevelde, E. Bosman and J. Vanfleteren, "UTCP: 60 um thick bendable chip package", Proceedings of IWLPS (San Jose), November 2006.
2. J. Govaerts, W. Christiaens, E. Bosman and J. Vanfleteren, "Fabrication Processes for Embedding Thin Chips in Flat Flexible Substrates", IEEE Transactions on Advanced Packaging, under review (proposed January 2008).