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Volumn 53, Issue 1, 2010, Pages 42-46

A rapid chemical method for improving peel strength at Cu-epoxy interfaces

Author keywords

Interfacial strength; Peel strength; Spray treatment

Indexed keywords

CHEMICAL BONDINGS; CHEMICAL METHOD; CHEMICAL TREATMENTS; CU SURFACES; EPOXY INTERFACE; INTERFACIAL STRENGTH; NANO SCALE; OXIDIZING TREATMENT; PEEL STRENGTH; SPRAY COVERAGE; SPRAY TECHNOLOGIES; SURFACE MODIFIERS; THERMOSET POLYMERS;

EID: 77649191560     PISSN: 01678442     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tafmec.2009.12.003     Document Type: Article
Times cited : (8)

References (17)
  • 1
    • 77649179599 scopus 로고
    • Process for Promoting the Interlaminate Adhesion of Polymeric Materials to Metal Surfaces,
    • United States Patent, 4,689,111, August 25
    • K.K. Chan, V.J. Malueg, Process for Promoting the Interlaminate Adhesion of Polymeric Materials to Metal Surfaces, United States Patent # 4,689,111, August 25 1987.
    • (1987)
    • Chan, K.K.1    Malueg, V.J.2
  • 2
    • 77649192510 scopus 로고
    • Interlaminate Adhesion between Polymeric Materials and Electrolytic Copper Surfaces,
    • United States Patent, 4,810,326, March 7
    • S.V. Babu, V.Q. Bui, J.G. Hoffarth, J.A. Welsh, Interlaminate Adhesion between Polymeric Materials and Electrolytic Copper Surfaces, United States Patent # 4,810,326, March 7 1989.
    • (1989)
    • Babu, S.V.1    Bui, V.Q.2    Hoffarth, J.G.3    Welsh, J.A.4
  • 3
    • 0001160510 scopus 로고
    • Adhesion improvement of copper/epoxy joint
    • Yun H.K., Cho K., An J.H., and Park C.E. Adhesion improvement of copper/epoxy joint. J. Mater. Sci. 27 (1992) 5811-5817
    • (1992) J. Mater. Sci. , vol.27 , pp. 5811-5817
    • Yun, H.K.1    Cho, K.2    An, J.H.3    Park, C.E.4
  • 4
    • 84972955601 scopus 로고
    • Effects of surface modification on the peel strength of copper based polymer/metal interfaces with characteristic morphologies
    • Love J., and Packman P.F. Effects of surface modification on the peel strength of copper based polymer/metal interfaces with characteristic morphologies. J. Adhes. 40 (1993) 139-150
    • (1993) J. Adhes. , vol.40 , pp. 139-150
    • Love, J.1    Packman, P.F.2
  • 5
    • 34247149235 scopus 로고    scopus 로고
    • Failure paths analyses of the leadframe/EMC system
    • Lee H.Y., and Kim S.R. Failure paths analyses of the leadframe/EMC system. J. Microelectron. Packaging Soc. 7 (2000) 7-12
    • (2000) J. Microelectron. Packaging Soc. , vol.7 , pp. 7-12
    • Lee, H.Y.1    Kim, S.R.2
  • 6
    • 0001365112 scopus 로고    scopus 로고
    • Effects of oxidation treatments on the fracture toughness of leadframe/epoxy interfaces
    • Lee H.Y., and Yu J. Effects of oxidation treatments on the fracture toughness of leadframe/epoxy interfaces. Mater. Sci. Eng. A 277 (2000) 154-160
    • (2000) Mater. Sci. Eng. A , vol.277 , pp. 154-160
    • Lee, H.Y.1    Yu, J.2
  • 7
    • 0037287372 scopus 로고    scopus 로고
    • Microstructure, adhesion strength and failure path at a polymer/roughened metal interface
    • Lee H.-Y., and Qu J. Microstructure, adhesion strength and failure path at a polymer/roughened metal interface. J. Adhes. Sci. Technol. 17 (2003) 195-215
    • (2003) J. Adhes. Sci. Technol. , vol.17 , pp. 195-215
    • Lee, H.-Y.1    Qu, J.2
  • 8
    • 10244256461 scopus 로고    scopus 로고
    • The effect of growth parameters on the aspect ratio and number density of CuO nanorods
    • Kumar A., Srivastava A.K., Tiwari P., and Nandekar R.V. The effect of growth parameters on the aspect ratio and number density of CuO nanorods. J. Phys.: Condens. Matter 16 (2004) 8531-8543
    • (2004) J. Phys.: Condens. Matter , vol.16 , pp. 8531-8543
    • Kumar, A.1    Srivastava, A.K.2    Tiwari, P.3    Nandekar, R.V.4
  • 9
    • 24344498718 scopus 로고    scopus 로고
    • Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based moulding compound systems after Pullout test
    • Lee H.-Y., Park Y.-B., Jeon I., and Kim Y.-H. Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based moulding compound systems after Pullout test. Mater. Sci. Eng. A 405 (2005) 50-64
    • (2005) Mater. Sci. Eng. A , vol.405 , pp. 50-64
    • Lee, H.-Y.1    Park, Y.-B.2    Jeon, I.3    Kim, Y.-H.4
  • 10
    • 34247112337 scopus 로고    scopus 로고
    • Oxidation of copper fiber surface to improve fracture toughness of Cu/epoxy composite
    • Wetherhold R.C., and Das P.K. Oxidation of copper fiber surface to improve fracture toughness of Cu/epoxy composite. Mater. Sci. Eng. A 460-461 (2007) 344-350
    • (2007) Mater. Sci. Eng. A , vol.460-461 , pp. 344-350
    • Wetherhold, R.C.1    Das, P.K.2
  • 11
    • 34249029413 scopus 로고    scopus 로고
    • Multiscale engineering of ductile fibers to improve fracture toughness
    • Wetherhold R.C., Corjon M., and Das P.K. Multiscale engineering of ductile fibers to improve fracture toughness. Compos. Sci. Technol. 67 (2007) 2428-2437
    • (2007) Compos. Sci. Technol. , vol.67 , pp. 2428-2437
    • Wetherhold, R.C.1    Corjon, M.2    Das, P.K.3
  • 15
    • 77649181587 scopus 로고    scopus 로고
    • Personal Communication, J.W. Cho, EMC Division of Dongjin Semichem, 12/07
    • Personal Communication, J.W. Cho, EMC Division of Dongjin Semichem, 12/07.
  • 16
    • 0023602637 scopus 로고
    • Subcritical crack growth along ceramic-metal interfaces
    • Oh T.S., Cannon R.M., and Ritchie R.O. Subcritical crack growth along ceramic-metal interfaces. J. Am. Ceram. Soc. C70 (1987) 352-355
    • (1987) J. Am. Ceram. Soc. , vol.C70 , pp. 352-355
    • Oh, T.S.1    Cannon, R.M.2    Ritchie, R.O.3
  • 17
    • 0024301167 scopus 로고
    • Sandwich test specimens for measuring interface crack toughness
    • Suo Z., and Hutchinson J.W. Sandwich test specimens for measuring interface crack toughness. Mater. Sci. Eng. A107 (1989) 135-143
    • (1989) Mater. Sci. Eng. , vol.A107 , pp. 135-143
    • Suo, Z.1    Hutchinson, J.W.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.