Research on lamellar structure and microhardness in directionally solidified ternary Sn-40.5Pb-2.6Sb eutectic alloy

Journal of Alloys and Compounds

Volumn 493, Issue 1-2, 2010, Pages 116-121

  Hu, X W ^a   Li, S M ^a   Gao, S F ^a   Liu, L ^a   Fu, H Z ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

Directional solidification; Lamellar spacings; Microhardness; Ternary alloy

Indexed keywords

CONSTANT TEMPERATURE; DIRECTIONAL SOLIDIFICATION; DIRECTIONALLY SOLIDIFIED; EUTECTIC ALLOYS; LAMELLAR SPACING; LAMELLAR SPACINGS; SN-PB ALLOYS;

CERIUM ALLOYS; CRYSTALLIZATION; LEAD; MICROHARDNESS; REGRESSION ANALYSIS; SOLIDIFICATION; TERNARY ALLOYS; TERNARY SYSTEMS; TIN; TIN ALLOYS;

LAMELLAR STRUCTURES;

EID: 77249177629     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.12.086     Document Type: Article

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