SCOPUS 정보 검색 플랫폼

Microelectronic Engineering

Volumn 87, Issue 5-8, 2010, Pages 1328-1330

A new simple method of fabricating micro/nano-scale polymer optical wires on a copper plate

(5) Lee, Hyun Shik a Jeon, Keum Soo b Park, Insu b An, Shinmo a Lee, El Hnag a

a Inha University (South Korea)

b Doosan Co (South Korea)

Author keywords

Copper wet etching; Electrical and optical wired board; Polymer optical wire

Indexed keywords

CLADDING LAYER; CLADDING MATERIAL; COPPER PLATE; COPPER SURFACE; CORE MATERIAL; CUT-BACK METHOD; ELECTRICAL AND OPTICAL WIRED BOARD; ELECTRICAL CIRCUIT; INNER SURFACES; POLYMER WIRES; PROPAGATION LOSS; SCATTERING LOSS; SIMPLE METHOD; WET-ETCH;

CLADDING (COATING); COPPER; COREMAKING; ETCHING; FILLED POLYMERS; PRINTED CIRCUIT MANUFACTURE; SURFACE ROUGHNESS; SURFACES; WIRE;

PRINTED CIRCUIT BOARDS;

EID: 76949104607 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2009.12.043 Document Type: Article

Times cited : (2)

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