Fully automated hot embossing processes utilizing high resolution working stamps

Microelectronic Engineering

Volumn 87, Issue 5-8, 2010, Pages 1037-1040

  Glinsner, T ^a   Veres, T ^b   Kreindl, G ^a   Roy, E ^b   Morton, K ^b   Wieser, T ^a   Thanner, C ^a   Treiblmayr, D ^a   Miller, R ^c   Lindner, P ^a  

^a EVGroup ^*  (Austria)

^b NATIONAL RESEARCH COUNCIL CANADA   (Canada)

^c EV Group Inc   (United States)

Author keywords

De embossing; High resolution; Hot embossing; Soft working stamps; Spin on layer

Indexed keywords

AUTOMATED MODE; BIOSENSING; HIGH RESOLUTION; HIGH-ASPECT RATIO; HOT EMBOSSING PROCESS; HOT-EMBOSSING; LAB-ON-CHIP; PATTERN TRANSFERS; POLYMER SUBSTRATE; REPLICATION PROCESS; REPLICATION TECHNOLOGY; SPIN-ON; THERMOPLASTIC MATERIALS; WORKING STAMPS;

ASPECT RATIO; AUTOMATION; NANOIMPRINT LITHOGRAPHY; SPIN DYNAMICS;

HOT WORKING;

EID: 76949098163     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.11.098     Document Type: Article

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