3D metallo-dielectric structures combining electrochemical and electroplating techniques

Microelectronic Engineering

Volumn 87, Issue 5-8, 2010, Pages 1458-1462

  Hernandez D ^a   Lange, D ^a   Trifonov, T ^a   Garin M ^a   Garcia M ^a   Rodriguez A ^a   Alcubilla, R ^a  

^a UNIVERSITAT POLITÈCNICA DE CATALUNYA   (Spain)

Author keywords

Electrochemical etching; Electroplating; Macroporous silicon; Photonic crystals; Three dimensional structures

Indexed keywords

3D NETWORKS; DEPOSITION TEMPLATES; ELECTROPLATING PROCESS; ELECTROPLATING TECHNIQUE; MACRO POROUS SILICON; METALLODIELECTRIC; PERIODIC ARRAYS; SINE-WAVE; THREE-DIMENSIONAL (3D); THREE-DIMENSIONAL STRUCTURE; VOID-FREE;

ELECTROPLATING; NICKEL ALLOYS; PERIODIC STRUCTURES; PHOTONIC CRYSTALS; POROUS SILICON; THREE DIMENSIONAL;

ELECTROCHEMICAL ETCHING;

EID: 76949096568     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.11.108     Document Type: Article

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