A study on the characteristics of a wafer-polishing process according to machining conditions

International Journal of Precision Engineering and Manufacturing

Volumn 10, Issue 1, 2009, Pages 23-28

  Lee, Jung Taik ^a   Won, Jong Koo ^a   Lee, Eun Sang ^a  

^a Inha University   (South Korea)

Author keywords

IR sensor; Loadcell; Machining properties; Surface roughness; Wafer polishing

Indexed keywords

EID: 76849103358     PISSN: 12298557     EISSN: None     Source Type: Journal    
DOI: 10.1007/s12541-009-0004-5     Document Type: Article

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