Fabrication of W-Cu composites by microwave infiltration

Journal of Alloys and Compounds

Volumn 492, Issue 1-2, 2010, Pages

  Guo, Yingli ^a   Yi, Jianhong ^a   Luo, Shudong ^a   Zhou, Chengshang ^a   Chen, Lifang ^a   Peng, Yuandong ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Electrical property; Infiltration; Microstructure; Microwave; W Cu composite

Indexed keywords

APPLICATION PROSPECT; ELECTRICAL CONDUCTIVITY; ELECTRICAL PROPERTY; HOMOGENEOUS MICROSTRUCTURE; INFILTRATION PROCESS; INFILTRATION TECHNIQUES; MICROWAVE RADIATIONS; W-CU COMPOSITES;

COPPER ALLOYS; ELECTRIC CONDUCTIVITY; MICROSTRUCTURE; SEEPAGE; SOIL MECHANICS; TUNGSTEN ALLOYS; TUNGSTEN COMPOUNDS;

MICROWAVES;

EID: 76549121279     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.12.011     Document Type: Letter

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