Microstructural characterization of W/Cu functionally graded materials produced by a one-step resistance sintering method

Journal of Alloys and Compounds

Volumn 428, Issue 1-2, 2007, Pages 146-150

  Zhou, Zhang Jian ^a   Du, Juan ^a   Song, Shu Xiang ^a   Zhong, Zhi Hong ^a   Ge, Chang Chun ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Copper; Functionally graded materials; Tungsten

Indexed keywords

COMPOSITION; COPPER; DENSIFICATION; HIGH PRESSURE EFFECTS; MICROSTRUCTURE; SINTERING; TUNGSTEN;

COMPOSITION DISTRIBUTION; MICROSTRUCTURAL CHARACTERIZATION; RESISTANCE SINTERING; ULTRA HIGH PRESSURES;

FUNCTIONALLY GRADED MATERIALS;

EID: 33845714285     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.03.073     Document Type: Article

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