Thermal conductivity of Al-SiCp composites by plasma spraying

Scripta Materialia

Volumn 52, Issue 1, 2005, Pages 51-56

  Gui, Manchang ^a,b   Kang, Suk Bong ^b   Euh, Kwangjun ^b  

^a BEIJING INSTITUTE OF AERONAUTICAL MATERIALS   (China)

^b Korea Institute of Machine and Materials   (South Korea)

Author keywords

Aluminum matrix composites; Plasma spraying; Porosity; Sic; Thermal boundary resistance; Thermal conductivity

Indexed keywords

ELECTRONICS PACKAGING; OPTICAL MICROSCOPY; PLASMA SPRAYING; POROSITY; PROTECTIVE COATINGS; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; THERMAL CONDUCTIVITY; WEAR RESISTANCE;

ALUMINIUM MATRIX COMPOSITES; CROSS SECTIONS; THERMAL BOUNDARY CONDUCTANCE; THERMAL BOUNDARY RESISTANCE;

ALUMINUM COMPOUNDS;

EID: 5744224743     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2004.08.028     Document Type: Article

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