The many faces of absorptive capacity: Spillovers of copper interconnect technology for semiconductor chips

Industrial and Corporate Change

Volumn 18, Issue 6, 2009, Pages 1249-1284

  Lim, Kwanghui ^a  

^a UNIVERSITY OF MELBOURNE   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

INDUSTRIAL TECHNOLOGY; KNOWLEDGE; RESEARCH AND DEVELOPMENT; SEMICONDUCTOR INDUSTRY; SPILLOVER EFFECT;

EID: 76249122041     PISSN: 09606491     EISSN: 14643650     Source Type: Journal    
DOI: 10.1093/icc/dtp044     Document Type: Article

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