Control of the cation stoichiometry in the multiferroic BiFeO3 thin films

Ferroelectrics

Volumn 374, Issue 1 PART 2, 2008, Pages 20-25

  Kartavtseva, M S ^a,b   Gorbenko, O Yu ^a   Kaul, A R ^a   Fusil, S ^b   Barthelemy A ^b   Bouzehouane, K ^b  

^a MOSCOW STATE UNIVERSITY   (Russian Federation)

^b CNRS   (France)

Author keywords

Isopiestic annealing; MOCVD; Multiferroics; Piezoresponse Force Microscopy

Indexed keywords

ANNEALING; FERROELECTRIC FILMS; FERROELECTRIC MATERIALS; IRON COMPOUNDS; METALLORGANIC CHEMICAL VAPOR DEPOSITION; NANOTECHNOLOGY; ORGANIC CHEMICALS; ORGANOMETALLICS; SCANNING PROBE MICROSCOPY; STOICHIOMETRY; THIN FILMS;

A3. METAL ORGANIC CHEMICAL VAPOR DEPOSITION (MOCVD); BIFEO3 THIN FILM; CATION STOICHIOMETRY; DIFFERENT SUBSTRATES; FERROELECTRIC PROPERTY; FILM STOICHIOMETRY; MULTIFERROICS; PIEZORESPONSE FORCE MICROSCOPY;

BISMUTH COMPOUNDS;

EID: 75449095255     PISSN: 00150193     EISSN: 15635112     Source Type: Journal    
DOI: 10.1080/00150190802424728     Document Type: Conference Paper

References (12)

1. H. Béa, M. Bibes, M. Sirena, G. Herranz, K. Bouzehouane, E. Jacquet, S. Fusil, P. Paruch, M. Dawber, J.-P. Contour, and A. Barthélémy, Appl. Phys. Lett. 88, 062502 (2006).
2. T. M. Maffitt, J. K. DeBrosse, E. T. Gabric, J. A. Gow, M. C. Lamorey, J. S. Parenteau, D. R. Willmott, M. A. Wood, and W. J. Gallagher, IBM J. Res. & Dev. 50(1), 25 (2006).
3. F. Bai, J. Wang, M. Wuttig, J. F. Li, N. Wang, A. P. Pyatakov, A. K. Zvezdin, L. E. Cross, and D. Viehland, Appl. Phys. Lett. 86, 032511 (2005).
4. J. Wang, J. B. Neaton, H. Zheng, V. Nagarajan, S. B. Ogale, B. Liu, D. Viehland, V. Vaithyanathan, D. G. Schlom, U. V. Waghmare, N. A. Spaldin, K. M. Rabe, M. Wuttig, and R. Ramesh, Science 299, 1719 (2003).
5. S. T. Zhang, M. H. Lu, D. Wu, Y. F. Chen, and N. B. Ming, Appl. Phys. Lett. 87, 262907 (2005).
6. H. Béa, M. Bibes, A. Barthélémy, K. Bouzehouane, E. Jacquet, A. Khodan, J.-P. Contour, S. Fusil, F. Wyczisk, A. Forget, D. Lebeugle, D. Colson, and M. Viret, Appl. Phys. Lett. 87, 072508 (2005).
7. R. Ueno, S. Okaura, H. Funakubo, and K. Saito, Jpn. J. Appl. Phys. 44(39), L1231 (2005).
8. S. Y. Yang, F. Zavaliche, L. Mohaddes-Ardabili, V. Vaithyanathan, D. G. Schlom, Y. J. Lee, Y. H. Chu, M. P. Cruz, Q. Zhan, T. Zhao, and R. Ramesh, Appl. Phys. Lett. 87, 102903 (2005).
9. M. S. Kartavtseva, O. Yu. Gorbenko, A. R. Kaul, A. R. Akbashev, T. V. Murzina, S. Fusil, A. Barthélémy, and F. Pailloux, Surface and coating technology 201, 9149 (2007).
10. A. A. Bosak, O. Yu. Gorbenko, A. R. Kaul, I. E. Graboy, C. Dubourdieu, J. P. Senateur, and H. W. Zandbergen, Journal of Magnetism and Magnetic Materials 211, 61 (2000).
11. M. S. Kartavtseva, O. Yu. Gorbenko, A. R. Kaul, T. V. Murzina, S. A. Savinov, and A. Barthélémy, Thin Solid Films 515, 6416 (2007).
12. K. Y. Yun, M. Noda, M. Okuyama, H. Saeki, H. Tabata, and K. J. Saito, J. Appl. Phys. 96(6), 3399.