Tin pest in Sn-0.5Cu lead-free solder alloys: A chemical analysis of trace elements

Journal of Electronic Materials

Volumn 39, Issue 1, 2010, Pages 105-108

  Leodolter Dworak, Monika ^a   Steffan, Ilse ^a   Plumbridge, William J ^b   Ipser, Herbert ^a  

^a UNIVERSITY OF VIENNA   (Austria)

^b OPEN UNIVERSITY   (United Kingdom)

Author keywords

Aging; Chemical analysis; Lead free solders; Metal and alloys; Phase transformations; Tin pest

Indexed keywords

LEAD FREE SOLDERS; METAL AND ALLOYS; PHASE TRANSFORMATION; PHASE TRANSFORMATIONS; TIN PESTS;

ALLOYS; CHEMICALS; COPPER ALLOYS; EMISSION SPECTROSCOPY; INDUCTIVELY COUPLED PLASMA; LEAD; METAL ANALYSIS; OPTICAL EMISSION SPECTROSCOPY; PHASE TRANSITIONS; SOLDERING ALLOYS; SPECTROSCOPIC ANALYSIS; TIN ALLOYS; TITANIUM COMPOUNDS; TRACE ANALYSIS; TRACE ELEMENTS;

TIN;

EID: 74449093108     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0958-1     Document Type: Article

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