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Volumn , Issue , 2002, Pages 23-26
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Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board
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Author keywords
[No Author keywords available]
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Indexed keywords
CRACK PROPAGATION;
CROSSTALK;
ELECTRIC LINES;
ELECTROMAGNETIC WAVE EMISSION;
INTERCHANGES;
PHOTOACOUSTIC EFFECT;
POWER TRANSMISSION;
QUALITY ASSURANCE;
REFLECTION;
RELIABILITY;
SIGNAL PROCESSING;
TRANSMISSION LINE THEORY;
EQUIVALENT CIRCUIT MODEL (ECM);
GROUND PLANE (GP);
HIGH SPEEDS;
MULTILAYER (ML);
SIDE EFFECTS;
SIGNAL CURRENTS;
SIGNAL PROPAGATION;
SIGNAL TRACES;
SIGNAL-INTEGRITY (SI);
TRANSMISSION LINE MODEL (TLM);
WAVEFORMS;
RADIATION EFFECTS;
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EID: 28444478584
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/SPI.2002.258281 Document Type: Conference Paper |
Times cited : (6)
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References (6)
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