Crossing the planes at high speed: Signal integrity issues at split ground and power planes

IEEE Circuits and Devices Magazine

Volumn 13, Issue 6, 1997, Pages 22-26

  Liaw, Haw Jyh ^a   Merkelo, Henri ^b  

^a RAMBUS INC   (United States)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; EQUIVALENT CIRCUITS; MICROELECTRONICS; MICROPROCESSOR CHIPS; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; SIGNAL THEORY; TRANSMISSION LINE THEORY;

SOFTWARE PACKAGE SPICE; SPLIT GROUND PLANES; SPLIT POWER PLANES;

COMPUTER CIRCUITS;

EID: 0031275558     PISSN: 87553996     EISSN: None     Source Type: Journal    
DOI: 10.1109/101.646555     Document Type: Article

References (7)

1. H.W. Johnson and M. Graham, High Speed Digital Design. Englewood Cliffs, NJ: Prentice Hall, 1993.
2. B. Schuppert, "Microstrip/slotline transitions: Modeling and experimental investigation," IEEE Trans. Microwave Theory & Tech., pp. 1272-1282, Aug. 1988.
3. K.C. Gupta, R. Garg, and I. Bahl, Microstrip Lines and Slotlines. Dedham, MA: Artech House, 1979.
4. R. Garg and K. Gupta, "Expressions for wavelength and impedance of a slotline," IEEE Trans. Microwave Theory &Tech., p. 532, Aug. 1976.
5. M. Maeda, "An analysis of gap in microstrip transmission lines," IEEE Trans. Microwave Theory & Tech., pp. 390-396, June 1972.
6. H.-J. Liaw and H. Merkelo, "Mode conversion at vias in multilayer interconnections," in Proc. 45th ECTC Conference, (Las Vegas, Nevada), May 1995.
7. R. Mittra and C. Gordon, Physical Architecture of VLSI Systems, edited by R. J. Hannemann, Al.D. Kraus, and M. Pecht, Ch. 8. Electrical Design of Packag-ing Systems, pp. 527-529. New York: John Wiley & Sons, Inc, 1994.