The effect of material and process interactions on BEOL integration

ECS Transactions

Volumn 25, Issue 7, 2009, Pages 279-289

  Spooner, T A ^a   Arnold, J C ^a   Canapeti, D ^a   Chen, H C ^a   Chen, S T ^a   Gates, S M ^b   Lsobayashi, A ^c   Leung, P ^a   Rao, S S Papa ^b   Sankarapandian, M ^a   Shobha, H ^a   Van Der Straten, O ^a  

^a IBM   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c Toshiba America Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMISTRY;

BACK-END-OF-LINE INTERCONNECT; BEOL INTEGRATION; CRITICAL DIMENSION; PROCESS INTERACTION; ROADMAP; SEMICONDUCTOR PROCESSING;

ELECTROCHEMICAL PROPERTIES;

EID: 74349098772     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3203966     Document Type: Conference Paper

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