Mechanisms of interdiffusion in Pd-Cu thin film diffusion couples

Thin Solid Films

Volumn 518, Issue 8, 2010, Pages 2010-2020

  Chakraborty, J ^a   Welzel, U ^a   Mittemeijer, E J ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

Depth profiling; Diffraction; Diffusion; Phase transitions

Indexed keywords

ANNEALING TIME; BI-LAYER; COLUMNAR GRAIN; CU THIN FILM; FILM SURFACES; GRAIN-BOUNDARY DIFFUSION; INTER-DIFFUSION; INTERDIFFUSION COEFFICIENTS; MACROSCOPIC DIFFUSION; POLYCRYSTALLINE; SPUTTER-DEPTH PROFILING; TEMPERATURE RANGE;

ACTIVATION ENERGY; AUGER ELECTRON SPECTROSCOPY; COPPER; DEPTH PROFILING; DIFFRACTION; DIFFUSION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; PALLADIUM; SPUTTERING; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

PHASE TRANSITIONS;

EID: 73949150894     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.08.026     Document Type: Article

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