High performance 3-dimensional hybrid-integrated switch matrix for Ka-band satellite communication applications based on ceramic multilayer technology

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 1-8

  Trabert, J F ^a   Drue K H ^a   Muller J ^a   Stephan, R ^a   Hein, M A ^a  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

1st and 2nd level interconnections; 3D hybrid integration; Broadband embedded RF transmission lines; Ka band; LTCC; Multimedia satellite communications; Thick film; Waveguide transition

Indexed keywords

1ST-AND 2ND-LEVEL INTERCONNECTIONS; 3D HYBRID-INTEGRATION; BROADBAND EMBEDDED RF-TRANSMISSION LINES; KA BAND; LTCC; MULTIMEDIA SATELLITES; WAVEGUIDE TRANSITION;

MICROELECTRONICS; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTILAYERS; OPTIMIZATION; SATELLITE COMMUNICATION SYSTEMS; SIGNAL PROCESSING; SWITCHING SYSTEMS; SYSTEMS ANALYSIS; THICK FILMS; TRANSMISSION LINE THEORY;

ELECTRIC LINES;

EID: 72949120210     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. G. Weaver, G. Thomas, G. Cobb., "Agile Equipments for an Advanced Ku/Ka Satellite", Official Meeting ITG-Fachausschuss 7.2, November 16, 2006, Backnang, Germany
3. http://www.itrs.net/Links/2006Update/2006UpdateFinal.htm
4. K.-H. Drüe, M. Hein, J. Müller, R. Perrone, S. Rentsch, R. Stephan, J. Trabert, "LTCC Multilayer Technology enables very compact 20 GHz Switch Unit for Space Applications," European Microelectronics and Packaging Conf., June 17-20, Oulu Finland 2007.
5. F.J. Schmückle, A. Jentzsch, W. Heinrich, J. Butz, M. Spinnler, "LTCC as MCM Substrate: Design of Strip-Line Structures and FlipChip Interconnects," 2001 IEEE MTTS Int. Microwave Symposium Dig., vol. 3, pp. 1903-1906, June 2001.
6. http://www.macom.com/DataSheets/MA4SW410B-1.pdf
7. J. Trabert, M. A. Hein, J. Müller, R. A. Perrone, R. Stephan, H. Thust, "High functional density low-temperature co-fired ceramic modules for satellite communications," 35th European Microwave Conference, October 3-7, 2005, Paris, France