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Volumn 157, Issue 1, 2010, Pages

Electroless gold plating on aluminum patterned chips for CMOS-based sensor applications

(11) Ko, Jung Woo a Koo, Hyo Chol b Kim, Dong Wan c Seo, Sung Min c Kang, Tae June c Kwon, Yongjoo a Yoon, Jung Lim a Cheon, Jun Ho c Kim, Yong Hyup c Kim, Jae Jeong b Park, Young June a,c

a National Core Research Center (South Korea)

b School of Chemical and Biological Engineering (South Korea)

c Seoul National University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AU ELECTRODES; AU FILM; AU PARTICLES; BATH TEMPERATURES; CHEMICAL CONCENTRATIONS; CMOS CIRCUITS; CMOS PROCESSS; CMOS-BASED SENSORS; COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; DIPCOATING METHODS; ELECTROLESS DEPOSITION; ELECTROLESS GOLD PLATING; METAL ELECTRODES; P TYPE SEMICONDUCTOR; PD ACTIVATION PROCESS; PD PARTICLE; RESISTANCE VARIATIONS; ROOM TEMPERATURE; SCHOTTKY BARRIERS; SELECTIVE DEPOSITION; SENSOR APPLICATIONS; SENSOR DEVICE;

ALUMINUM; CARBON NANOTUBES; CONTACT RESISTANCE; CRYSTAL RESONATORS; FIELD EFFECT TRANSISTORS; GOLD DEPOSITS; METALLIC COMPOUNDS; MOS DEVICES; PALLADIUM; SCHOTTKY BARRIER DIODES; SENSORS; SINGLE-WALLED CARBON NANOTUBES (SWCN);

GOLD;

EID: 72249086812 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3244208 Document Type: Article

Times cited : (23)

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