Thermal management of a 3D chip stack using a liquid interface to a synthetic jet cooled spreader

15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009

Volumn , Issue , 2009, Pages 186-191

  Kota, Krishna ^a   Hidalgo, Pablo ^a   Joshi, Yogendra ^a   Glezer, Ari ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING AIR; HEAT SPREADERS; HEATED AIR; HIGH-POWER; LIQUID INTERFACE; LOCAL HEAT TRANSFER COEFFICIENT; NUMERICAL SIMULATION; OVERALL HEAT TRANSFER COEFFICIENT; SYNTHETIC JET ACTUATORS; SYNTHETIC JETS; THERMAL MANAGEMENT; THERMAL PATHS;

ACTUATORS; AIR ENTRAINMENT; DIELECTRIC LIQUIDS; FINS (HEAT EXCHANGE); HEAT EXCHANGERS; HEAT TRANSFER COEFFICIENTS; JETS; SPREADERS; TEMPERATURE CONTROL; THREE DIMENSIONAL;

PHASE INTERFACES;

EID: 71749112603     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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