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Volumn 95, Issue 18, 2009, Pages

Large electromechanical coupling factor film bulk acoustic resonator with X-cut LiNbO3 layer transfer

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE FILMS; CRYSTALLINE ORIENTATIONS; DEEP REACTIVE ION ETCHING; DIRECT BONDING; ELECTRO MECHANICAL COUPLING FACTORS; FILM BULK ACOUSTIC RESONATORS; LAYER TRANSFER; LITHIUM NIOBATE; TEST VEHICLE; ULTRA-WIDE BAND RADIOS;

EID: 71049142299     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3258496     Document Type: Article
Times cited : (38)

References (12)
  • 5
    • 33947423949 scopus 로고    scopus 로고
    • Wafer direct bonding: From advanced substrate engineering to future applications in micro/nanoelectronics
    • DOI 10.1109/JPROC.2006.886026
    • S. H. Christiansen, R. Singh, and U. Gösele, Proc. IEEE 0018-9219 94, 2060 (2006). 10.1109/JPROC.2006.886026 (Pubitemid 46445559)
    • (2006) Proceedings of the IEEE , vol.94 , Issue.12 , pp. 2060-2105
    • Christiansen, S.H.1    Singh, R.2    Gosele, U.3
  • 12


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.