-
2
-
-
33847137644
-
-
(IEEE, Rotterdam).
-
P. Muralt, J. Antifakos, M. Cantoni, R. Lanz, and F. Martin, Proceedings of the International Ultrasonic Symposium, 315 (IEEE, Rotterdam, 2005).
-
(2005)
Proceedings of the International Ultrasonic Symposium
, pp. 315
-
-
Muralt, P.1
Antifakos, J.2
Cantoni, M.3
Lanz, R.4
Martin, F.5
-
3
-
-
0035202319
-
Materials for bulk acoustic wave (BAW) resonators and filters
-
DOI 10.1016/S0955-2219(01)00329-6, PII S0955221901003296
-
H. P. Lobl, M. Klee, R. Milsom, R. Dekker, C. Metzmacher, W. Brand, and P. Lok, J. Eur. Ceram. Soc. 0955-2219 21, 2633 (2001). 10.1016/S0955-2219(01) 00329-6 (Pubitemid 33119261)
-
(2001)
Journal of the European Ceramic Society
, vol.21
, Issue.15
, pp. 2633-2640
-
-
Lobl, H.P.1
Klee, M.2
Milsom, R.3
Dekker, R.4
Metzmacher, C.5
Brand, W.6
Lok, P.7
-
4
-
-
36749120742
-
-
0003-6951,. 10.1063/1.1655114
-
H. C. Huang, J. D. Knox, Z. Turski, R. Wargo, and J. J. Hanak, Appl. Phys. Lett. 0003-6951 24, 109 (1974). 10.1063/1.1655114
-
(1974)
Appl. Phys. Lett.
, vol.24
, pp. 109
-
-
Huang, H.C.1
Knox, J.D.2
Turski, Z.3
Wargo, R.4
Hanak, J.J.5
-
5
-
-
33947423949
-
Wafer direct bonding: From advanced substrate engineering to future applications in micro/nanoelectronics
-
DOI 10.1109/JPROC.2006.886026
-
S. H. Christiansen, R. Singh, and U. Gösele, Proc. IEEE 0018-9219 94, 2060 (2006). 10.1109/JPROC.2006.886026 (Pubitemid 46445559)
-
(2006)
Proceedings of the IEEE
, vol.94
, Issue.12
, pp. 2060-2105
-
-
Christiansen, S.H.1
Singh, R.2
Gosele, U.3
-
6
-
-
34748920142
-
-
(IEEE, Honolulu).
-
Y. Osugi, T. Yoshino, K. Suzuki, and T. Hirai, Proceedings of the MTT-s International Microwave Symposium, 873 (IEEE, Honolulu, 2007).
-
(2007)
Proceedings of the MTT-s International Microwave Symposium
, pp. 873
-
-
Osugi, Y.1
Yoshino, T.2
Suzuki, K.3
Hirai, T.4
-
7
-
-
6644219832
-
-
0361-5235,. 10.1007/s11664-001-0067-2
-
B. Aspar, H. Moriceau, E. Jalaguier, C. Lagahe, A. Soubie, B. Biasse, A. M. Papon, A. Claverie, J. Grisolia, G. Benassayag, F. Letertre, O. Rayssac, T. Barge, C. Maleville, and B. Ghyselen, J. Electron. Mater. 0361-5235 30, 834 (2001). 10.1007/s11664-001-0067-2
-
(2001)
J. Electron. Mater.
, vol.30
, pp. 834
-
-
Aspar, B.1
Moriceau, H.2
Jalaguier, E.3
Lagahe, C.4
Soubie, A.5
Biasse, B.6
Papon, A.M.7
Claverie, A.8
Grisolia, J.9
Benassayag, G.10
Letertre, F.11
Rayssac, O.12
Barge, T.13
Maleville, C.14
Ghyselen, B.15
-
8
-
-
51349115551
-
-
0003-6951,. 10.1063/1.2976560
-
K. Diest, M. J. Archer, J. A. Dionne, Y. B. Park, M. J. Czubakowski, and H. A. Atwater, Appl. Phys. Lett. 0003-6951 93, 092906 (2008). 10.1063/1.2976560
-
(2008)
Appl. Phys. Lett.
, vol.93
, pp. 092906
-
-
Diest, K.1
Archer, M.J.2
Dionne, J.A.3
Park, Y.B.4
Czubakowski, M.J.5
Atwater, H.A.6
-
9
-
-
71049143117
-
-
(IEEE, Beijing).
-
M. Pijolat, J. S. Moulet, A. Reinhardt, E. Defa, C. Deguet, D. Gachon, B. Ghyselen, M. Ad, and S. Ballandras, Proceedings of the International Ultrasonic Symposium, 201 (IEEE, Beijing, 2008).
-
(2008)
Proceedings of the International Ultrasonic Symposium
, pp. 201
-
-
Pijolat, M.1
Moulet, J.S.2
Reinhardt, A.3
Defa, E.4
Deguet, C.5
Gachon, D.6
Ghyselen, B.7
Ad, M.8
Ballandras, S.9
-
10
-
-
71049187610
-
-
(IEEE, New York).
-
J. S. Moulet, M. Pijolat, J. Dechamp, F. Mazen, A. Tauzin, F. Rieutord, A. Reinhardt, E. Defa, C. Deguet, B. Ghyselen, L. Clavelier, M. Ad, S. Ballandras, and C. Mazuŕ, Proceedings of the International Electron Devices Meeting (IEEE, New York, 2008).
-
(2008)
Proceedings of the International Electron Devices Meeting
-
-
Moulet, J.S.1
Pijolat, M.2
Dechamp, J.3
Mazen, F.4
Tauzin, A.5
Rieutord, F.6
Reinhardt, A.7
Defa, E.8
Deguet, C.9
Ghyselen, B.10
Clavelier, L.11
Ad, M.12
Ballandras, S.13
Mazuŕ, C.14
-
11
-
-
0344467175
-
-
0021-8979,. 10.1063/1.1621053
-
A. Reinhardt, Th. Pastureaud, V. Laude, and S. Ballandras, J. Appl. Phys. 0021-8979 94, 6923 (2003). 10.1063/1.1621053
-
(2003)
J. Appl. Phys.
, vol.94
, pp. 6923
-
-
Reinhardt, A.1
Pastureaud, Th.2
Laude, V.3
Ballandras, S.4
|