An electrometric method to measure the mechanical parameters of MEMS devices

Conference on Optoelectronic and Microelectronic Materials and Devices, Proceedings, COMMAD

Volumn 2002-January, Issue , 2002, Pages 221-224

  Li, Jiang ^a   Gao, Zhongyu ^a   Dong, Jingxin ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

FREQUENCY RESPONSE;

COMB FINGERS; ELECTROMETRIC METHOD; HIGH-ACCURACY; MECHANICAL PARAMETERS; MECHANICAL STIFFNESS; MEMSDEVICES; SENSING ELEMENTS; SPECIAL STRUCTURE;

MICROELECTRONICS;

EID: 71049132041     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/COMMAD.2002.1237232     Document Type: Conference Paper

References (5)

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3. Quanbo Zou. Zhijian Li, Litian Liu, International Conference on Solid-State and Integrated Circuit Technology Proceedings, IEEE. Oct 24-28 (1995) 488-490
4. GAO Zhongyu. Chinese Journal of Mechanical Engineering, 37, 3 (2001) 97-101
5. YUAN Guang, DING Henggao, GAO Zhongyu, Journal of Tsinghua University (Sci & Tech). 38, 11 (1998) 38-41