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Volumn , Issue , 2009, Pages 172-173
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Impact of backside Cu contamination in the 3D integration process
a a a
a
HITACHI LTD
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
3-D INTEGRATION;
ASSEMBLY PROCESS;
CU DIFFUSION;
GETTERING;
LOW TEMPERATURES;
WAFER THINNING;
ION BOMBARDMENT;
ION IMPLANTATION;
SILICON NITRIDE;
STRESS RELIEF;
THREE DIMENSIONAL;
CONTAMINATION;
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EID: 71049127467
PISSN: 07431562
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (17)
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References (6)
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