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Volumn , Issue , 2009, Pages 172-173

Impact of backside Cu contamination in the 3D integration process

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ASSEMBLY PROCESS; CU DIFFUSION; GETTERING; LOW TEMPERATURES; WAFER THINNING;

EID: 71049127467     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (17)

References (6)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.