Packaging and reliability research on automobiles micro-pressure sensor

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 2009, Pages 307-310

  Guan, R F ^a  

^a SUZHOU UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CAVITY STRUCTURE; DESIGNING STRUCTURES; DIE BONDING; FABRICATING PROCESS; FATIGUE CHARACTERISTICS; HIGH QUALITY; MEMS TECHNOLOGY; PACKAGING PROCESS; PASSIVATING LAYER; SILICONE OIL; TEMPERATURE STABILITY; ZERO POINT;

FAILURE ANALYSIS; INTEGRATED CIRCUITS; PRESSURE EFFECTS; PRESSURE SENSORS; PRESSURE TRANSDUCERS; QUALITY ASSURANCE; SAFETY FACTOR; SILICONES;

PACKAGING MATERIALS;

EID: 71049116901     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPFA.2009.5232646     Document Type: Conference Paper

References (8)

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