Study on plasma cleaning and strength of wire bonding

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability

Volumn , Issue , 2004, Pages 65-71

  Guan, Rongfeng ^a   Wang, Xuefang ^a   Zhu, Fulong ^a   Gan, Zhiyin ^a   Liu, Sheng ^a   Huang, Dexiu ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Plasma cleaning; Process parameters optimization; Pull test; Wire bonding strength

Indexed keywords

ARGON; CHARGED PARTICLES; CLEANING; ELECTRONICS PACKAGING; IONIZATION; MICROELECTROMECHANICAL DEVICES; PLASMAS; PRINTED CIRCUIT BOARDS;

PLASMA CLEANING; PROCESS PARAMETERS OPTIMIZATION; PULL TEST; WIRE BONDING STRENGTH;

OPTOELECTRONIC DEVICES;

EID: 4544367236     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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