X-ray microscopy for interconnect characterization

AIP Conference Proceedings

Volumn 1173, Issue , 2009, Pages 145-148

  Gelb, Jeff ^a   Yun, Wenbing ^a   Feser, Michael ^a   Tkachuk, Andrei ^a  

^a XRADIA INC   (United States)

Author keywords

High resolution; Interconnect; Packaging; Semiconductor; TSV (Through Silicon Via); X ray imaging

Indexed keywords

EID: 70450277450     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.3251210     Document Type: Conference Paper

References (6)

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3. A. Tkachuk, M. Feser, H. Cui, F. Duewer, H. Chang, W. Yun, High-resolution x-ray tomography using laboratory sources, Proceedings of SPIE 6318, 63181D (2006)
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5. W. Chao, B. D. Harteneck, J. A. Liddle, E. H. Anderson, and D. T. Attwood, "Soft X-ray microscopy at a spatial resolution better than 15 nm," Nature 435, 1210-1213 (30 June 2005).
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