System packaging & integration for a swallowable capsule using a direct access sensor

2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

  Jesudoss, Pio ^a   Mathewson, Alan ^a   Wright, William ^b   McCaffrey, Colm ^a   Ogurtsov, Vladimir ^a   Twomey, Karen ^a   Stam, Frank ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

^b UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

ACA; Direct access sensor; Flexible substrate; Flip chip over hole; Polysiloxane

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES; BIOMEDICAL MICROSYSTEMS; DIRECT ACCESS; ELECTRICAL CONNECTION; ENCAPSULATION METHODS; FLEXIBLE SUBSTRATE; FLIP CHIP; FLIP CHIP OVER HOLE; GI TRACT; NEW OPPORTUNITIES; PACKAGING METHODS; POLYSILOXANES; SENSOR CHIPS; SENSOR PACKAGING; SYSTEM ELECTRONICS; SYSTEM PACKAGING; TECHNOLOGICAL DEVELOPMENT; ZERO-LEVEL PACKAGING;

ADHESIVE JOINTS; ELECTRIC CONNECTORS; ELECTRONIC EQUIPMENT MANUFACTURE; ENCAPSULATION; MICROELECTRONICS; PACKAGING; SENSORS; SILICONES; SUBSTRATES; TECHNOLOGICAL FORECASTING;

CHIP SCALE PACKAGES;

EID: 70449839170     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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