Electrically conductive adhesives with sintered silver nanowires

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 834-837

  Zhongxian, Zhang ^a   Xiangyan, Chen ^a   Haowei, Yang ^a   Huiying, Fu ^a   Fei, Xiao ^a  

^a FUDAN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BULK METALS; CONDUCTIVE ADHESIVE; CONTACT POINTS; ELECTRICALLY CONDUCTIVE ADHESIVES; ENVIRONMENTAL FRIENDLINESS; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; FINE PITCH; LEAD FREE SOLDERS; LOW STRESS; METAL PARTICLE; MICROELECTRONIC PACKAGING; NANO-SIZE; POLYOL PROCESS; PROCESSING CONDITION; SEM; SILVER NANOWIRES; SLENDERNESS RATIOS; TIN-LEAD SOLDERS;

ADHESIVES; ELECTRIC RESISTANCE MEASUREMENT; ELECTRIC WIRE; ELECTRONICS PACKAGING; FIELD EMISSION; FIELD EMISSION MICROSCOPES; MELTING POINT; METAL MELTING; MICROELECTRONICS; NANOWIRES; PACKAGING; SCANNING ELECTRON MICROSCOPY; SILVER; SINTERING; SMELTING; SOLDERING ALLOYS; TIN;

LEAD;

EID: 70449813022     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270629     Document Type: Conference Paper

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