Design and fabrication of corrosion and humidity sensors for performance evaluation of chip scale hermetic packages for biomedical implantable devices

2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

  Saeidi, Nooshin ^a   Demosthenous, Andreas ^a   Donaldson, Nick ^a   Alderman, John ^b  

^a UNIVERSITY COLLEGE LONDON   (United Kingdom)

^b UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

Biomedical packaging; Capacitive humidity sensors; Hermeticity testing; Test chip

Indexed keywords

BIOMEDICAL IMPLANTS; CAPACITIVE HUMIDITY SENSORS; CHIP SCALE; CORROSION SENSOR; HERMETIC PACKAGES; HERMETICITY TESTING; IMPLANTABLE DEVICES; MICRON TECHNOLOGIES; PERFORMANCE EVALUATION; SEALING TECHNIQUE; TARGET APPLICATION; TEST CHIP; TEST CHIPS; TYNDALL;

CORROSION; HUMIDITY SENSORS; MICROELECTRONICS; MOISTURE; PACKAGING;

CHIP SCALE PACKAGES;

EID: 70449805704     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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