Stronger silicon for microsystems

Acta Materialia

Volumn 58, Issue 2, 2010, Pages 439-448

  Boyce, B L ^a   Shaw, M J ^a   Lu, P ^a   Dugger, M T ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Chemical vapor deposition; Fracture; Lithography; Tension test; Ultrafine grained microstructure

Indexed keywords

COARSE-GRAINED MATERIALS; FINE-GRAINED MATERIAL; GRAIN BOUNDARY GROOVES; GRAIN SIZE; MECHANICAL PERFORMANCE; MICRO TENSILE TESTS; MICROFABRICATED; PHOSPHOROUS DOPING; POLY-SI; POLYCRYSTALLINE SILICON (POLY-SI); PREFERENTIAL ETCHING; STRENGTH VALUES; TENSION TEST; ULTRAFINE-GRAINED MICROSTRUCTURE;

CHEMICAL VAPOR DEPOSITION; DOPING (ADDITIVES); FRACTURE; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; GRANULAR MATERIALS; LITHOGRAPHY; MICROCRYSTALLINE SILICON; MICROFABRICATION; MICROSTRUCTURE; PHOSPHORUS; POLYSILICON; TENSILE TESTING;

TENSILE STRENGTH;

EID: 70449482705     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.09.022     Document Type: Article

References (26)

1. Ballarini R., Kahn H., Tayebi N., and Heuer A.H. Effects of microstructure on the strength and fracture toughness of polysilicon: a wafer level testing approach. In: Muhlstein C.L.B.S.B. (Ed). Symposium on mechanical properties of structural films (2000), American Society Testing and Materials, Orlando, (FL) 37
2. Cho S.W., Jonnalagadda K., and Chasiotis I. Fatigue Fract Eng Mater Struct 30 (2007) 21
3. Foulk J.W., Johnson G.C., Klein P.A., and Ritchie R.O. J Mech Phys Solids 56 (2008) 2381
4. Cook R.F. J Mater Sci 41 (2006) 841
5. Son D., Kim J.J., Lim T.W., and Kwon D. Thin Solid Films 468 (2004) 167
6. Ballarini R., Mullen R.L., and Heuer A.H. Int J Fract 95 (1999) 19
7. Alsem D.H., Boyce B.L., Stach E.A., and Ritchie R.O. Sens Actuator A-Phys 147 (2008) 553
8. Chasiotis I., and Knauss W.G. J Mech Phys Solids 51 (2003) 1533
9. Robertson W.M. J Am Ceram Soc 64 (1981) 9
10. Alan T., Hines M.A., and Zehnder A.T. Appl Phys Lett (2006) 89
11. Miller D.C., Boyce B.L., Dugger M.T., Buchheit T.E., and Gall K. Sensors Actuators: A Phys 138 (2007) 130
12. Kahn H., Deeb C., Chasiotis I., and Heuer A.H. J Microelectromech Syst 14 (2005) 914
13. Pierron O.N., Macdonald D.D., and Muhlstein C.L. Appl Phys Lett (2005) 86
14. Miller D.C., Becker C.R., and Stoldt C.R. J Electrochem Soc 155 (2008) F253
15. Miller D.C., Gall K., and Stoldt C.R. Electrochem Solid State Lett 8 (2005) G223
16. Miller D.C., Boyce B.L., Gall K., and Stoldt C.R. Appl Phys Lett (2007) 90
17. Miller D.C., Boyce B.L., Kotula P.G., and Stoldt C.R. J Appl Phys (2008) 103
18. McAllister P.V., and Cutler I.B. J Am Ceram Soc 55 (1972) 351
19. Sniegowski J.J., and de Boer M.P. Annu Rev Mater Sci 30 (2000) 299
20. Boyce B.L., Grazier J.M., Buchheit T.E., and Shaw M.J. J Microelectromech Syst 16 (2007) 179
21. Sullivan J.D., and Lauzon P.H. J Mater Sci Lett 5 (1986) 1245
22. Bergman B. J Mater Sci Lett 3 (1984) 689
23. DelRio F.W., Dunn M.L., Boyce B.L., Corwin A.D., and de Boer M.P. T J Appl Phys (2006) 99
24. Boyce B.L., Ballarini R., and Chasiotis I. J Micromech Microeng (2008) 18
25. Alan T., Zehnder A.T., Sengupta D., and Hines M.A. Appl Phys Lett (2006) 89
26. Kahn H., Avishai A., Ballarini R., and Heuer A.H. Scripta Mater 59 (2008) 912