Design of a multi-axis implantable MEMS sensor for intraosseous bone stress monitoring

Journal of Micromechanics and Microengineering

Volumn 19, Issue 8, 2009, Pages

  Alfaro, Fernando ^a   Weiss, Lee ^b   Campbell, Phil ^b   Miller, Mark ^c,d   Fedder, Gary K ^b  

^a Silicon Microstructures Inc   (United States)

^b CARNEGIE MELLON UNIVERSITY   (United States)

^c ALLEGHENY GENERAL HOSPITAL   (United States)

^d UNIVERSITY OF PITTSBURGH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BASIC RESEARCH; BENDING LOAD; BI-CMOS PROCESS; BIOMECHANICAL PROPERTIES; BONE GRAFT; BONE MATERIALS; BONE QUALITY; BONE STRENGTH; CLINICAL MANAGEMENT; CMOS-MEMS; DATA RETRIEVAL; FINITE ELEMENT ANALYSIS; INTERFACIAL AREAS; LIVING BONE; MEMS CHIPS; MEMS SENSORS; MICRO-SCALES; MULTI-AXIS; MULTI-AXIS SENSORS; NONINVASIVE MEASUREMENTS; PIEZO-RESISTIVE; RF TELEMETRY; SENSOR DESIGNS; SENSOR INTEGRATION; SENSOR SYSTEMS; STRESS MONITORING; STRESS SENSOR; STRESS TENSORS; TEXTURED SURFACE; WIRED SENSORS;

BIOMECHANICS; DESIGN; FABRICATION; GRAFTS; MEMS; MICROELECTROMECHANICAL DEVICES; SENSORS;

BONE;

EID: 70350666526     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/8/085016     Document Type: Article

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