Capacitive coupling for power and data telemetry to implantable biomedical microsystems

2009 4th International IEEE/EMBS Conference on Neural Engineering, NER '09

Volumn , Issue , 2009, Pages 411-414

  Sodagar, Amir M ^a,b   Amiri, Parviz ^c  

^a K N TOOSI UNIVERSITY OF TECHNOLOGY   (Iran)

^b UNIVERSITY OF MICHIGAN   (United States)

^c TARBIAT MODARES UNIVERSITY   (Iran)

Author keywords

Biomedical implants; Data telemetry; Implantable microsystems; Power telemetry; Wireless data transfer

Indexed keywords

BIOMEDICAL IMPLANTS; DATA TELEMETRY; IMPLANTABLE MICROSYSTEMS; POWER TELEMETRY; WIRELESS DATA TRANSFER;

DATA TRANSFER; MEASUREMENT THEORY; MICROSYSTEMS;

TELEMETERING EQUIPMENT;

EID: 70350231638     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NER.2009.5109320     Document Type: Conference Paper

References (5)

1. S. Ullerich, W. Mokwa, and U. Schnakenberg, "Micro Coils for Improved Power Transfer Telemetry Systems," Proc. of the 2nd Annual Int'l IEEE-EMBS Special Topic Conference on Microtechnologies in Medicine and Biology, pp. 420-423, May 2002, Madison, Wisconsin, USA.
2. J. A. Von Arx, and K. Najafi, "On-Chip Coils with Integrated Cores for Remote Inductive Powering of Integrated Microsystems," Proc. of the 1997 In'l Conf. on Solid-State Sensors and Actuators, pp. 999-1002, June 1997, Chacago, IL.
3. A. Fazzi, R. Canegallo, L. Ciccarelli, L. Magagani, F. Natali, E. Jung, P. Rolandi, and R. Guerrieri, "3-D capacitive Interconnections with Mono- and Bi-Directional Capabilities," IEEE J. Solid-State Cir., Vol. 43, No. 1, Jan. 2008, pp. 275-284.
4. E. Culurciello, and A.G. Andreou, "Capacitive Coupling of Data and Power for 3D Silicon-On-Isolator VLSI," Proc. 2005 IEEE Int'l Symp. Cir. and Syst. (ISCAS'05), Vol. 4, pp. 4142-4145.
5. Z. Yang, et al, "Simplified permittivity measurement of human skin invivo," Proc. IEEE Northeast Bioengineering Conf., pp. 121-122, 2000.