Capacitive coupling of data and power for 3d silicon-on-insulator vlsi

Proceedings - IEEE International Symposium on Circuits and Systems

Volumn , Issue , 2005, Pages 4142-4145

  Culurciello, Eugenio ^a   Andreou, Andreas G ^b  

^a Yale University   (United States)

^b Johns Hopkins University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D VLSI; BI-DIRECTIONAL COMMUNICATION; CAPACITIVE COUPLINGS; ENABLING TECHNOLOGIES; POWER SUPPLY; SILICON ON INSULATOR; SILICON-ON-SAPPHIRE; WAFER STACKING;

CORUNDUM; DIES; SILICON WAFERS; THREE DIMENSIONAL;

ELECTRONICS PACKAGING;

EID: 67649103938     PISSN: 02714310     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISCAS.2005.1465543     Document Type: Conference Paper

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