Low cost hot embossing process for plastics microfluidic chips fabrication

2009 6th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, ECTI-CON 2009

Volumn 1, Issue , 2009, Pages 462-464

  Lomas, T ^a,b   Mongpraneet, S ^a   Wisitsoraat, A ^a   Jaruwongrungsee, K ^a   Sappat, A ^a   Maturos, T ^a   Chevasuvit, F ^b   Tuantranont, Adisorn ^a  

^a NATIONAL ELECTRONICS AND COMPUTER TECHNOLOGY CENTER   (Thailand)

^b KING MONGKUT'S INSTITUTE OF TECHNOLOGY LADKRABANG   (Thailand)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM SUBSTRATE; CNC MILLING MACHINE; CONTROL ELECTRONICS; HEATING SYSTEM; HIGH PRECISION; HOT EMBOSSING PROCESS; HOT-EMBOSSING; LOW COSTS; MICRO MOLDS; MICROFLUIDIC CHIP; MICROMACHINES; OPTIMUM TEMPERATURE; PLASTIC MICROFLUIDIC CHIPS; SINGLE STAGE; WORK PROGRAMS;

ALUMINA; ENGINES; FLUIDIC DEVICES; HYDRAULIC MACHINERY; INFORMATION TECHNOLOGY; MICROFLUIDICS; PISTONS; SHEET MOLDING COMPOUNDS;

BIOCHIPS;

EID: 70350070584     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTICON.2009.5137048     Document Type: Conference Paper

References (6)

1. S.H. Hong, J.H. Lee, and H. Lee, J. Microelectronics Eng. 84 (2007), pp. 977-979.
2. T. Koerner, L. Beown, R. Xie, and R.D. Oleschuk, J. Sensor and Actuators B, 107 (2005), pp. 632-639.
3. S.W. Youn, H. Goto, M. Takahashi, and S. Oyama, J. Microelectronic Engineering,(2007), pp. 405-412.
4. D. A. Mair, Emil Geiger, A.P. Pisano, J. Lab on a Chip, (2006), pp.101-109.
5. C.H. Lin, C.H. Chao, C.W. Lan, J. Sensors and Actuators, (2007), pp. 698-705.
6. C.Y. Chang, S.Y. Yang, M.H. Chu, J. Microelectronic Engneering, (2006), pp. 94-99.