3D temperature measurement in ic chips using confocal raman spectroscopy

Materials Research Society Symposium Proceedings

Volumn 1022, Issue , 2007, Pages 26-31

  Shabani, Javad ^a   Wang, Xi ^a   Shakouri, Ali ^a  

^a University of California Santa Cruz   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D MEASUREMENT; ACTIVE AREA; CONFOCAL RAMAN SPECTROSCOPY; IC CHIPS; MICRO-HEATERS; MICRON SIZE; SUBMICRON; SURFACE TEMPERATURE MEASUREMENT; TEMPERATURE DETERMINATION; TEMPERATURE PROFILES; THEORETICAL CALCULATIONS;

HEAT TRANSFER; NANOSTRUCTURED MATERIALS; RAMAN SCATTERING; RAMAN SPECTROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; TEMPERATURE CONTROL; TEMPERATURE MEASUREMENT; THREE DIMENSIONAL; UNCERTAINTY ANALYSIS;

SEMICONDUCTOR DEVICES;

EID: 70349923739     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. G. Chrysler, Proceedings, Next-Generation Thermal Management Materials and Systems Symposium, Dallas, TX, Oct. 2002
2. M. Conn, "Confocal Microscopy", Academic Press 1999
3. J. Christofferson, A. Shakouri, Microelectronics J., 35, 791 (2004)
4. M. Malyj and J. E. Griffiths, Appl. Spectrosc. 37, 315 (1983)
5. F. LaPlant, G. Laurence and D. Ben-Amotz, Appl. Spectrosc. 50, number 8, (1996)
6. G. Zeng, et al., Material Research Society, Fall Meeting, Proc. vol. 793 Boston (2004)
7. S. M. Sze, "Physics of Semiconductors", Wiley-Interscience 1981
8. J. Shabani, X. Wang, A. Shakouri, to be submitted
9. N.J. Everall, App. Spectrosc. 54, 773 (2000)
10. and also see N.J. Everall, App. Spectrosc. 54, 1515 (2000)