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2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008

Volumn , Issue , 2008, Pages 86-89

Highly integrated flexible electronic circuits and modules

(6) Loher, Thomas a Seckel, Manuel a Pahl, Barbara a Böttcher, Lars b Ostmann, Andreas b Reichl, Herbert a

a TECHNISCHE UNIVERSITÄT BERLIN (Germany)

b FRAUNHOFER IZM (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVES; BUILD-UP LAYERS; ELECTRONIC CIRCUITS; ELECTRONIC SYSTEMS; FABRICATION TECHNOLOGIES; FLEX CIRCUITS; FLEXIBLE CIRCUITS; FLEXIBLE ELECTRONIC CIRCUITS; FLEXIBLE PRINTED CIRCUITS; FUNCTIONAL DENSITIES; HANDHELD; HIGHLY INTEGRATED; LINE WIDTHS; MANUFACTURING METHODS; MARKET SHARES; MEDICAL DEVICES; MOBILE APPLIANCES; PASSIVE COMPONENTS; RESEARCH INSTITUTES; TECHNIQUES AND RESULTS;

AUTOMOBILE ELECTRONIC EQUIPMENT; COMPETITION; ELECTRON TUBES; ELECTRONIC EQUIPMENT MANUFACTURE; HEARING AIDS; MICROSYSTEMS; PRINTED CIRCUITS;

TECHNOLOGY;

EID: 64049085046 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/IMPACT.2008.4783814 Document Type: Conference Paper

Times cited : (11)

References (7)

1
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- Smart PCB manufacturing technologies
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- (2005) Proceedings ICEPT
- Loeher, T.¹ Neumann, A.² Boettcher, L.³ Pahl, B.⁴ Ostmann, A.⁵ Aschenbrenner, R.⁶ Reichl, H.⁷

2
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- IMAPS (2008) Scottsdale/Fountain Hills, AZ, USA
- B. Pahl, T. Loeher, H. Burkard, J. Link, A. Petersen, R. Aschenbrenner, Flex Technology for Foldable Medical Flip Chip Devices, IMAPS (2008) Scottsdale/Fountain Hills, AZ, USA
- Flex Technology for Foldable Medical Flip Chip Devices
- Pahl, B.¹ Loeher, T.² Burkard, H.³ Link, J.⁴ Petersen, A.⁵ Aschenbrenner, R.⁶

3
- 51349095714
- Ultra Thin, Flexible Electronics
- Orlando
- B. Holland, R. Mcpherson, T. Zhang, Z. Hou, R. Dean, R. Johnson, L. Del Castillo, and A. Moussessian, Ultra Thin, Flexible Electronics, Proceedings ECTC; Orlando (2008), p. 1110-1116
- (2008) Proceedings ECTC , pp. 1110-1116
- Holland, B.¹ Mcpherson, R.² Zhang, T.³ Hou, Z.⁴ Dean, R.⁵ Johnson, R.⁶ Del Castillo, L.⁷ Moussessian, A.⁸

4
- 64049088527
- UTCP: A Novel Polyimide based Ultra-Thin Chip packaging Technology
- submitted
- W. Christiaens, E. Bosman, J. Vanfleteren, UTCP: a Novel Polyimide based Ultra-Thin Chip packaging Technology, IEEE Trans. on Components and Packaging Technologies, (2008) submitted.
- (2008) IEEE Trans. on Components and Packaging Technologies
- Christiaens, W.¹ Bosman, E.² Vanfleteren, J.³

5
- 64049085820
- Functionality and reliability testing of Bendable Ultrathin Chip Packages (UTCP's)
- Helsingoer, Denmark
- W. Christiaens, T. Torfs, W. Huwel, J. Vanfleteren, Functionality and reliability testing of Bendable Ultrathin Chip Packages (UTCP's), Proc. IMAPS Nordic Conference, Helsingoer, Denmark, (2008).
- (2008) Proc. IMAPS Nordic Conference
- Christiaens, W.¹ Torfs, T.² Huwel, W.³ Vanfleteren, J.⁴

6
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- Heidelberg: Springer Berlin
- A. Fach, Y. Athanassov, U. Brunner, D. Hablützel, B. Ketterer and J. Link, Multilayer polyimide film substrate for interconnections in microsystems, Microsystem Technologies, Heidelberg: Springer Berlin Volume 5 (1999) pp. 166-168
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7
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- Hans Burkard, Thin Film Resistor Integration into Flex-Boards, 5th International Workshop ,Flexible Electronic Systems', November 29(2006) Munich
- Hans Burkard, Thin Film Resistor Integration into Flex-Boards, 5th International Workshop ,Flexible Electronic Systems', November 29(2006) Munich

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