메뉴 건너뛰기




Volumn 113, Issue 39, 2009, Pages 12944-12951

Phenolic resin surface restructuring upon exposure to humid air: A sum frequency generation vibrational spectroscopic study

Author keywords

[No Author keywords available]

Indexed keywords

MICROELECTRONICS; PACKAGING MATERIALS; PHENOLIC RESINS; PLASTICS; RESINS; SPECTROSCOPIC ANALYSIS; SURFACES; VIBRATIONAL SPECTROSCOPY;

EID: 70349486833     PISSN: 15206106     EISSN: None     Source Type: Journal    
DOI: 10.1021/jp9058092     Document Type: Article
Times cited : (29)

References (78)
  • 2
    • 0023868087 scopus 로고
    • Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process
    • Lin, R.; Blackshear, E.; Serisky, P. Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process. Proc. 26th Rel. Phys. Symp. 1988, 83-89.
    • (1988) Proc. 26th Rel. Phys. Symp. , pp. 83-89
    • Lin, R.1    Blackshear, E.2    Serisky, P.3
  • 4
    • 84920514351 scopus 로고    scopus 로고
    • RoHS is the abbreviation of the following documentation: The restriction of the use of certain hazardous substances in electrical and electronic equipment. 19
    • RoHS is the abbreviation of the following documentation: The restriction of the use of certain hazardous substances in electrical and electronic equipment. Off. J. Eur. Union 2003, 46, L37, 19.
    • (2003) Off. J. Eur. Union , vol.46
  • 60
    • 6744248168 scopus 로고
    • Shen, Y. R. Nature 1989, 337, 519-525.
    • (1989) Nature , vol.337 , pp. 519-525
    • Shen, Y.R.1
  • 62
    • 85067766078 scopus 로고    scopus 로고
    • This temperature is located in the range of the normal processing temperatures for fabrication of typical electronic encapsulating materials
    • This temperature is located in the range of the normal processing temperatures for fabrication of typical electronic encapsulating materials.
  • 71
    • 85067746888 scopus 로고    scopus 로고
    • The formulation is at the courtesy of Henkel Huawei Electronic Materials Co, Ltd
    • The formulation is at the courtesy of Henkel Huawei Electronic Materials Co, Ltd.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.