Plasma altered layer model for plasma damage characterization of porous OSG films

Proceedings of the 2009 IEEE International Interconnect Technology Conference, IITC 2009

Volumn , Issue , 2009, Pages 78-80

  Shi, H ^a   Huang, H ^a   Bao, J ^a   Im, J ^a   Ho, P S ^a   Zhou, Y ^b   Pender, J T ^b   Armacost, M ^b   Kyser, D ^b  

^a The University of Texas at Austin   (United States)

^b APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALTERED LAYER; CARBON CONCENTRATIONS; DAMAGE FORMATION; GAP STRUCTURES; ION ENERGIES; LOW K DIELECTRICS; MATERIAL RESISTANCE; OPTICAL MASK; ORGANOSILICATE GLASS; PLASMA DAMAGE; PLASMA PRE-TREATMENT; PLASMA-INDUCED DAMAGE; RADICAL CONCENTRATION; RADICAL DIFFUSION; SUBSTRATE TEMPERATURE; VUV PHOTON;

CARBON FILMS; HELIUM; PHOTONS; REACTION KINETICS;

PLASMAS;

EID: 70349449881     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090345     Document Type: Conference Paper

References (8)

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