A new perspective of barrier material evaluation and process optimization

Proceedings of the 2009 IEEE International Interconnect Technology Conference, IITC 2009

Volumn , Issue , 2009, Pages 206-208

  Zhao, Larry ^a   Tokei, Zsolt ^b   Gischia, Gianni Giai ^b,c   Volders, Henny ^b   Beyer, Gerald ^b  

^a Intel Corporation Belgium   (Belgium)

^b IMEC   (Belgium)

^c UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

ALD Ru; Barrier; CDO; Cu low k; CuMn; Interconnect; Planar capacitor; Reliability; Self forming barrier

Indexed keywords

ALD RU; BARRIER; CDO; CU/LOW-K; CUMN; INTERCONNECT; PLANAR CAPACITOR; SELF-FORMING BARRIER;

CAPACITANCE; CAPACITORS; DESIGN; DIELECTRIC FILMS; PROCESS CONTROL; RELIABILITY;

STRUCTURAL OPTIMIZATION;

EID: 70349446740     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090389     Document Type: Conference Paper

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