Over one million TPCC with a 45nm 6-core xeon® CPU

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn , Issue , 2009, Pages

  Kuppuswamy, Ravi ^a   Sawant, Shankar R ^a   Balasubramanian, Srikanth ^a   Kaushik, Pradeep ^a   Natarajan, Narayanan ^a   Gilbert, Jeffrey D ^a  

^a INTEL TECHNOLOGY INDIA PVT LTD   (India)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 70349283740     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2009.4977312     Document Type: Conference Paper

References (3)

1. V. George, S. Jahagirdar, C. Tong, et al. "Penryn: 45nm Next Generation Intel Core 2 Processor." A-SSCC Dig. Tech Papers, pp. 14-17, Nov. 2007.
2. K. Mistry, C. Allen, C. Auth, et al., "A 45nm Logic Technology with High-k+ Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging", IEDM Dig. Tech Papers, pp. 247-250, Dec. 2007.
3. K Kuhn, C. Kenyon, A. Kornfeld, et al. "Managing Process Variation in Intel's 45 nm CMOS Technology." Intel Technology Journal, vol.12, no.2, pp. 93-109, Jun. 2008.