Thermal limits for integration of directly modulated lasers with Driver IC on SOI

Conference on Optical Fiber Communication, Technical Digest Series

Volumn , Issue , 2009, Pages

  Wohlfeil, B ^a   Zimmermann, L ^a   Petermann, K ^a   Kreissl, J ^b   Gustat, H ^c  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER HEINRICH HERTZ INSTITUTE   (Germany)

^c IHP   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN RULES; DIRECTLY MODULATED LASER DIODES; DIRECTLY MODULATED LASERS; DRIVER IC; THERMAL CROSSTALK; THERMAL LIMITS; THERMAL MODELLING;

CAPACITANCE; OPTICAL COMMUNICATION; OPTICAL FIBERS; OPTICAL MATERIALS;

BICMOS TECHNOLOGY;

EID: 70349277162     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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2. T. Mitze et al., " CWDM Transmitter Module Based on Hybrid Integration, " Selected Topics in Quantum Electronics, IEEE Journal of, vol.12, no.5, pp. 983-987, Sept.-Oct. 2006.
3. C. J. Glassbrenner and G. A. Slack, " Thermal conductivity of silicon and germanium from 3K to the melting point", Phys. Rev., vol. 134, pp. A1058-A1069, May 1964.
4. M.B. Kleiner et al., " Thermal conductivity measurements of thin silicon dioxide films in integrated circuits", Electron Devices, IEEE Transactions on, vol.43, no.9, pp.1602-1609, Sep 1996.
5. Wlodzimierz Nakwaski, " Thermal conductivity of binary, ternary, and quaternary III-V compounds", J. Appl. Phys. 64, 159 (1988), DOI:10.1063/1.341449.
6. A. Delan et al, " Thermal conductivity of ultra low-k dielectrics", Microelectronic Engineering Volume 70, Issues 2-4, Materials for Advanced Metallization 2003, November 2003, Pages 280-284.