Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn , Issue , 2009, Pages 470-472

  Yoshida, Yoichi ^a   Nose, Koichi ^b   Nakagawa, Yoshihiro ^b   Noguchi, Koichiro ^b   Morita, Yasuhiro ^b   Tago, Masamoto ^b   Kuroda, Tadahiro ^a   Mizuno, Masayuki ^b  

^a KEIO UNIVERSITY   (Japan)

^b NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 70349272856     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2009.4977512     Document Type: Conference Paper

References (6)

1. C.V. Sellathamby, et al., "Non-contact Wafer Probe Using Wireless Probe Cards," Proc. International Test Conference, paper 18.3, Nov. 2005.
2. N. Miura, et al., "An 11Gb/s Inductive-Coupling Link with Burst Transmission," ISSCC Dig. Tech. Papers, pp. 298-299, Feb. 2008.
3. N. Ghittori, et al., "1.2-V Low-power Multi-mode DAC+filter Blocks for Reconfigurable (WLAN/UMTS, WLAN/bluetooth) Transmitters," IEEE J. Solid-State Circuits, pp. 1970- 1982, Sept. 2006.
4. M. Takamiya, et al., "A Sampling Oscilloscope Macro toward Feedback Physical Design Methodology," IEEE Symp. VLSI Circuits, pp. 240-243, June 2004.
5. K. Suh, et al., "A 3.3 V 32 Mb NAND Flash Memory with Incremental Step Pulse Programming Scheme," IEEE J. Solid-State Circuits, pp. 1149-1156, Nov. 1995.
6. Wing-Hung Ki, "Circuit Design for Power Management Building Blocks," IEEE Symp. VLSI Circuits Short Course, pp. 30-31, June 2008.