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Volumn 3, Issue 9, 2009, Pages 534-541

Effect of cure cycle on curing process and hardness for epoxy resin

Author keywords

Degree of cure field; Epoxy resin; Hardness; Temperature field; Thermosetting resins

Indexed keywords


EID: 69949146351     PISSN: 1788618X     EISSN: None     Source Type: Journal    
DOI: 10.3144/expresspolymlett.2009.67     Document Type: Article
Times cited : (95)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.