Temperature field of thick thermoset composite laminates during cure process

Composites Science and Technology

Volumn 65, Issue 3-4, 2005, Pages 517-523

  Guo, Zhan Sheng ^a   Du, Shanyi ^a   Zhang, Boming ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

C. Finite element analysis; Temperature field

Indexed keywords

AUTOCLAVES; COMPUTER SIMULATION; CURING; DIFFERENTIAL EQUATIONS; FINITE ELEMENT METHOD; HEAT TRANSFER; MATRIX ALGEBRA; NUMERICAL METHODS; PROBLEM SOLVING; THERMAL EFFECTS; THERMOSETS;

COMPOSITE LAMINATES; EXOTHERMIC CHEMICAL REACTIONS; TEMPERATURE GRADIENTS; VACUUM BAG PROCESS;

LAMINATED COMPOSITES;

COMPOSITE;

EID: 11344291817     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2004.07.015     Document Type: Article

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