Effect of low temperature on fatigue life and cyclic stress-strain response of ultrafine-grained copper

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 38 A, Issue 9, 2007, Pages 1910-1915

  Lukas P ^a   Kunz, L ^a   Svoboda, M ^a  

^a INSTITUTE OF PHYSICS OF MATERIALS   (Czech Republic)

Author keywords

[No Author keywords available]

Indexed keywords

EQUAL CHANNEL ANGULAR PRESSING; FATIGUE OF MATERIALS; GRAIN BOUNDARY SLIDING; LOW TEMPERATURE EFFECTS; PLASTIC DEFORMATION; STRESS-STRAIN CURVES; THERMAL EFFECTS;

CONVENTIONAL-GRAIN COPPER; TEMPERATURE-INDEPENDENT BULK DISLOCATION MECHANISM; ULTRAFINE-GRAINED COPPER;

COPPER;

EID: 34548643576     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-007-9108-7     Document Type: Conference Paper

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